Electronic Flux Soldering Paste Tin Solder Flux Solder Paste for Precision Welding, Machines, Metals, Phones, PC Boards, BGA SMT PCB, High Activity

Excellent Adhesion - Our solder paste provides excellent adhesion, ensuring your solder joints are stable and reliable. Ideal for precision electronic applications, ensuring a perfect fit for every connection Solder Paste The solder paste flux is made without acid, lead-free, clean-free, resistance-free, non-conductive and non-corrosive to electronic components. It is very suitable for soldering integrated circuits and BGA Process: Solder paste is packed in metal cans and iron cans. Wipe the surface of the item before soldering and apply the solder paste to copper, iron, tin and other metals that need to be soldered. Then use a soldering iron to melt the tin at the solder joint Minimal Residue: Our flux paste is specially formulated to leave minimal residue, making it easy to clean solder joints and achieves clean and precise work. This keeps your work area tidy and your solder connections perfect. Flow Net Weight: (3.52 oz/100 g) Applications Soldering Paste: Soldering flux paste mobile phone repair, IT and digital service industry, SMT high precision PCB welding, BGA welding process, repair and desoldering, welding of electronic components, mobile phone repair, LED lighting, home appliance repair, etc